"Empowering Smart Mechatronics Innovations: Robotics, AI, and Intelligent Systems for a Connected Intelligent World"

The ICSMECH 2026 Committee proudly presents a series of exclusive side events as part of the International Conference on Smart Mechatronics (ICSMECH 2026), designed to enrich the conference experience and deepen engagement among participants. Held alongside the main conference from 9–11 June 2026 at The Trans Luxury Hotel Bandung, Indonesia, these side events called “ICSMech Forum on Multidisciplinary Engineering and Emerging Digital Technologies”.

These sessions aim to bridge the gap between theory and real-world application by bringing together researchers, industry experts, innovators, and practitioners. Participants will have the opportunity to engage in focused forums, panel discussions, workshops, and networking sessions that highlight cutting-edge advancements and practical implementations across various domains of engineering and digital transformation.

Key themes explored within the side events include Chemical engineering, Civil engineering, Electric and electronic engineering, Mechanical engineering, Materials engineering, Bioengineering, Environmental engineering, Computer and software engineering, Biomedical engineering. Through these activities, the forum fosters a collaborative ecosystem that encourages knowledge exchange, strengthens interdisciplinary partnerships, and promotes impactful innovation.

By participating in these side events, attendees can gain deeper insights into emerging trends, expand professional networks, and contribute to shaping the future of intelligent engineering systems in an increasingly connected world.

Organized by:

Chemical engineering

Civil engineering

Electric and electronic engineering

Mechanical engineering

Materials engineering

Bioengineering

Environmental engineering

Computer and software engineering

Biomedical engineering

Before submitting a paper to Engineering Proceedings, please note that Engineering Proceedings only accepts submissions from the conferences we cooperated with. The peer review process is handled by the conference organizers and proceedings editors, and the detailed review procedure will vary according to the policy of each conference. All conferences are requested to adhere to the minimum standards suggested on the page “Instruction for Conference Organizers”.

The instructions provided here will assist you in the preparation of your paper. For more detailed information, please visit the following link: https://www.mdpi.com/journal/engproc/instructions


For any queries regarding paper submission, please feel free to reach out to us. We look forward to receiving your submissions and seeing you at ICSMech 2026!

Submission deadline :

30 April 2026

Accepted Notification :

10 May 2026

Final Paper (Camera Ready) :

07 May 2026

Final Payment and Registration :

20 May 2026

Conference Date :

9-11 June 2026

Fee Rupiah USD
Student Rp4,500,000 $375
Professional Rp6,000,000 $500
Online presenter Rp4,000,000 $350
Extra page Rp1,000,000 $100
Extra paper for Offline presenter Rp3,000,000 $225
Extra paper for Online presenter Rp2,000,000 $200

* Additional Condition:

An additional publication fee might apply (maximum IDR 1,000,000 / $100, subject to the MDPI proposal)

* Additional Package:

Accomodation (Room/Night) : IDR 1.500.000 / $150

•⁠ Gala Dinner: IDR 200.000 / $20

•⁠ City Tour: IDR 250.000 / $25

* Bank Account for Registration Payment :

Beneficiary Name : TELKOM UNIVERSITY

Bank Name : Bank BNI

VA Number : 8321066202500109

* Bank Account for Registration Payment:

Account Number  : 1310095019917

Account Name : Universitas Telkom

Bank Name : Bank Mandiri

Bank Address : Jl. Telekomunikasi Ters. Buah Batu

Bank City : Bandung

Bank Country : Indonesia

SWIFT code : BMRIIDJA

The Trans Luxury Hotel - Bandung, Indonesia

Jl. Gatot Subroto No.289, Cibangkong, Kec. Batununggal, Kota Bandung, Jawa Barat 40273

Contact

Secretariat of ICSMech 2026

Email : icsmech@brin.go.id

Instagram : www.instagram.com/icsmech

Research Center For Smart Mechatronics, National Research and Innovation Agency (BRIN), KST Samaun Samadikun, Tower 1, Lantai 5  Jl. Sangkuriang,Dago, Coblong, Bandung, 40135, Indonesia

School of Industrial and System Engineering, Telkom University,  Room 18.02, TULT Building, 18th floor, Jalan Telekomunikasi No. 1, Ters. Buah Batu, Bandung. Indonesia.

© ICSMech-FORUM 2026